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ClampTM 4-Line ESD protection Array
PROTECTION PRODUCTS - MicroClampTM Description
The ClampTM series of TVS arrays are designed to protect sensitive electronics from damage or latch-up due to ESD. They are designed for use in applications where board space is at a premium. Each device requires less than 2.9mm2 of PCB area and will protect up to four lines. They are unidirectional devices and may be used on lines with positive signal polarities. The clampTM3304A is constructed using Semtech's proprietary EPD process technology. The EPD process provides low standoff voltages with significant reductions in leakage currents and capacitance over silicon-avalanche diode processes. They feature a true operating voltage of 3.3 volts for superior protection when compared to traditional pn junction devices. These devices may be used to meet the immunity requirements of IEC 61000-4-2, level 4. They offer desirable characteristics for board level protection including fast response time, low operating and clamping voltage, and no device degradation. The small SC89 package makes them ideal for use in portable electronics such as cell phones, PDAs, notebook computers, and digital cameras.
UCLAMP3304A
Features
Transient protection for data lines to IEC 61000-4-2 (ESD) 15kV (air), 8kV (contact) IEC 61000-4-4 (EFT) 40A (5/50ns) Protects four unidirectional I/O lines Ultra-small SC-89 package (1.7 x 1.7 x 0.6mm 0.6mm) 1.7 2 requires less than 2.9mm of PCB area Working voltage: 3.3V Low leakage current Low operating and clamping voltages Solid-state silicon-avalanche technology
Mechanical Characteristics
SC-89 (SOT-666) package Molding compound flammability rating: UL 94V-0 Marking: Marking Code Lead Finish: Matte Tin RoHS Compliant Weight: 2.9mg (typical) Packaging: Tape and Reel per EIA 481
Applications
Cellular Handsets and Accessories Cordless Phones Notebooks and Handhelds Portable Instrumentation Digital Cameras Peripherals MP3 Players
Dimensions
1.70 0.50
Schematic & PIN Configuration
1.25
1.70
0.30
0.60
Maximum Dimensions (mm)
Revision 02/25/05 1
SC-89 (Top View)
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Clamp3304A
PROTECTION PRODUCTS Absolute Maximum Rating
R ating Peak Pulse Power (tp = 8/20s) Maximum Peak Pulse Current (tp = 8/20s) ESD per IEC 61000-4-2 (Air) ESD per IEC 61000-4-2 (Contact) Lead Soldering Temperature Operating Temperature Storage Temperature Symbol Pp k Ip p V PP TL TJ TSTG Value 40 5 +/- 20 +/- 15 260 (10 sec.) -55 to +125 -55 to +150 Units Watts Amps kV C C C
Electrical Characteristics (T=25oC)
Parameter Reverse Stand-Off Voltage Punch-Through Voltage Snap -Back Voltage Reverse Leakage Current Clamp ing Voltage Clamp ing Voltage Reverse Clamp ing Voltage Junction Cap acitance Symbol VRWM V PT VSB IR VC VC VCR Cj IPT = 2A ISB = 50mA VRWM = 3.3V IPP = 1A, tp = 8/20s IPP = 5A, tp = 8/20s IPP = 1A, tp = 8/20s I/O p in to Gnd VR = 0V, f = 1MHz I/O p in to Gnd VR = 3.3V, f = 1MHz 22 3.5 2.8 0.05 0.5 5.5 8.0 2.4 30 Conditions Minimum Typical Maximum 3.3 Units V V V A V V V pF
14
pF
2005 Semtech Corp.
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Clamp3304A
PROTECTION PRODUCTS Typical Characteristics
Non-Repetitive Peak Pulse Power vs. Pulse Time
1
Power Derating Curve
110 100 90 % of Rated Power or IPP 80 70 60 50 40 30 20 10 0
Peak Pulse Power - P PP (kW)
0.1
0.01 0.1 1 10 Pulse Duration - tp (s) 100 1000
0
25
50
75
100
o
125
150
Ambient Temperature - TA ( C)
Clamping Voltage vs. Peak Pulse Current
12 10 Clamping Voltage - VC (V)
Junction Capacitance vs. Reverse Voltage
25.0 f = 1 MHz 20.0 Capacitance - Cj (pF) 5
8 6 4 2 0 0 1 2 3 4 Waveform Parameters: tr = 8s td = 20s
15.0
10.0
5.0
0.0 0 0.5 1 1.5 2 2.5 Reverse Voltage - VR (V) 3 3.5
Peak Pulse Current - IPP (A)
Forward Voltage vs Forward Current
ESD Clamping (8kV Contact per IEC 61000-4-2)
7 6 Forward Voltage - VF (V) 5 4 3 2 1 0 0 1 2 3 Forward Current - IF (A) 4 5 6
Waveform Parameters: tr = 8s td = 20s
2005 Semtech Corp.
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Clamp3304A
PROTECTION PRODUCTS Applications Information
Device Connection for Protection of Four Data Lines These devices are designed to protect up to four unidirectional data lines. The device is connected as follows: 1. Unidirectional protection of four I/O lines is achieved by connecting pins 1, 3, 4, and 6 to the data lines. Pins 2 and 5 are connected to ground. The ground connection should be made directly to the ground plane for best results. The path length is kept as short as possible to reduce the effects of parasitic inductance in the board traces. Circuit Board Layout Recommendations for Suppression of ESD. Good circuit board layout is critical for the suppression of ESD induced transients. The following guidelines are recommended: Place the TVS near the input terminals or connectors to restrict transient coupling. Minimize the path length between the TVS and the protected line. Minimize all conductive loops including power and ground loops. The ESD transient return path to ground should be kept as short as possible. Never run critical signals near board edges. Use ground planes whenever possible. Matte Tin Lead Finish Matte tin has become the industry standard lead-free replacement for SnPb lead finishes. A matte tin finish is composed of 100% tin solder with large grains. Since the solder volume on the leads is small compared to the solder paste volume that is placed on the land pattern of the PCB, the reflow profile will be determined by the requirements of the solder paste. Therefore, these devices are compatible with both lead-free and SnPb assembly techniques. In addition, unlike other lead-free compositions, matte tin does not have any added alloys that can cause degradation of the solder joint. Circuit Diagram
1
3
4
6
2, 5
Protection of Four Unidirectional Lines
2005 Semtech Corp.
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Clamp3304A
PROTECTION PRODUCTS Typical Applications
UCLAMP3304A
2005 Semtech Corp.
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Clamp3304A
PROTECTION PRODUCTS Applications Information - Spice Model
Figure 1 - Clamp3304A Spice Model
Table 1 - Clamp3304A Spice Parameters Parameter IS BV VJ RS IB V CJO TT M N EG Unit Amp Volt Volt Ohm Amp Farad sec --eV D1 (T VS) 1.00E-20 3.47 14 0.737 1.0E-3 14.53E-12 2.541E-9 0.152 1.1 1.11 D2 (LCR D) 1.00E-20 8 0.70 0.795 1.0E-3 6E-12 2.541E-9 0.152 1.1 1.11
2005 Semtech Corp.
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Clamp3304A
PROTECTION PRODUCTS Outline Drawing - SC-89 (SOT-666)
D A N E/2 E1 E D
L 1 e Nxb B aaa C A-B D 2 c
A
DIM C
A b c D E E1 e L L1 N aaa
DIMENSIONS INCHES MILLIMETERS MIN NOM MAX MIN NOM MAX
.019 .024 .005 .012 .003 .007 .059 .063 .067 .061 .063 .067 .043 .047 .049 .020 BSC .003 .008 .012 .003 .006 .008 6 .004 0.50 0.60 0.15 0.30 0.10 0.18 1.50 1.60 1.70 1.55 1.60 1.70 1.10 1.20 1.25 0.50 BSC 0.10 0.20 0.30 0.10 0.15 0.20 6 0.10
L1
NOTES: 1. CONTROLLING DIMENSIONS ARE IN MILLIMETERS (ANGLES IN DEGREES). 2. DIMENSIONS "E1" AND "D" DO NOT INCLUDE MOLD FLASH, PROTRUSIONS OR GATE BURRS.
Land Pattern - SC-89 (SOT-666)
X
Y C
DIM
C P G X Y Z
DIMENSIONS INCHES MILLIMETERS
(.057) .020 .024 .012 .033 .090 (1.45) 0.50 0.60 0.30 0.85 2.30
Z
G
Y
P NOTES: 1. THIS LAND PATTERN IS FOR REFERENCE PURPOSES ONLY CONSULT YOUR MANUFACTURING GROUP TO ENSURE YOUR COMPANY'S MANUFACTURING GUIDELINES ARE MET.
2005 Semtech Corp.
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Clamp3304A
PROTECTION PRODUCTS Marking Code Ordering Information
Part Number uClamp 3304A.TCT Working Voltage 3.3V Device Qty per Marking Reel SS 3,000 Reel Size 7 Inch
SS
Note: (1) Device is symmetrical so there is no pin 1 identifier
Note: Lead finish is lead-free matte tin MicroClamp, uClamp and Clamp are trademarks of Semtech Corporation
Tape and Reel Specification
SS
SS
SS
Tape Specifications and Device Orientation
Contact Information
Semtech Corporation Protection Products Division 200 Flynn Rd., Camarillo, CA 93012 Phone: (805)498-2111 FAX (805)498-3804
www.semtech.com
2005 Semtech Corp.
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